Micron Technology
Manufactures DRAM and NAND flash memory chips, including HBM for AI accelerators.
- Part of the chain
- Integrated device manufacturers
- Headquarters
- United States
- Listing
- NASDAQ: MU
- SEC CIK
- 0000723125
- Links
- Company website · Investor relations
Filed figures
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Customers and suppliers, as its annual report states them
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Fabrication and packaging sites
11 site(s) recorded on the fab map: 6 operating, 4 under construction, 1 announced. Grouped by the status each site is published under, in the same order on every page. The order is not a judgement about which sites matter. A site run by a joint venture appears on every partner's page.
Operating 6
| Site | Location | Wafer | Nodes | First output |
|---|---|---|---|---|
| Sanand ATMP Facility | Sanand, Gujarat, India | not recorded | not recorded | 2026 |
| Hiroshima Fab | Higashihiroshima, Hiroshima, Japan | 300 mm | 1-beta DRAM, 1-gamma DRAM, HBM | not recorded |
| Fab 10 | Woodlands, Singapore | 300 mm | 3D NAND | not recorded |
| Fab 11 / A3 | Taichung, Taiwan | 300 mm | 1-beta DRAM, 1-gamma DRAM | not recorded |
| Boise leading-edge fab | Boise, Idaho, United States | 300 mm | 1-gamma DRAM | 2024 |
| Manassas fab | Manassas, Virginia, United States | 200 mm | 1-alpha DRAM | 2026 |
Under construction 4
| Site | Location | Wafer | Nodes | First output |
|---|---|---|---|---|
| Hiroshima Fab Expansion | Higashihiroshima, Hiroshima, Japan | 300 mm | 1-gamma DRAM, HBM | not recorded |
| Fab 10B / 10X and HBM advanced packaging facility | Woodlands, Singapore | 300 mm | 3D NAND | not recorded |
| Tongluo Fab (former PSMC P5 site) | Tongluo, Miaoli, Taiwan | 300 mm | not recorded | not recorded |
| Clay megafab | Clay, New York, United States | 300 mm | not recorded | not recorded |
Announced 1
| Site | Location | Wafer | Nodes | First output |
|---|---|---|---|---|
| Second Boise fab | Boise, Idaho, United States | 300 mm | not recorded | not recorded |
Node bands
Nodes are recorded on 7 of the 11 sites here, so this is not a full picture of what the company runs. Which bands those nodes fall into, under each definition this record holds. A band is a publisher's statement on a date and not this record's classification: N7 was the leading edge when it arrived and is ordinary now, and nothing about the node changed. So the answer is computed against each definition and shown with the date of it.
5 value(s) on these sites are not a nanometre figure, so no scheme above places them: 1-alpha DRAM, 1-beta DRAM, 1-gamma DRAM, 3D NAND, HBM. These bands are stated in nanometres.
Published by Micron
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Named in a headline
A literal text match on the company's name, counted and not curated. It misses items that discuss the company without naming it, and collects items that only mention the name. It is not a measure of coverage.
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How these lists are built
Published by the company. Published by the company itself, so these involve no matching at all. Source: Micron Investor Relations.
Matched on the company's name in the headline, counted and not curated. This is a literal text match: the name as written, or the same name in capitals, and nothing else. It is not a judgement about what an item is about, so it misses items that discuss the company without naming it, and collects items that only mention the name. It is not a measure of coverage. Strings matched: Micron, Micron Technology. Not matched when the headline also contains Hana Micron, because that names a different company.
Sites are joined by the operator string in the fab data, which is declared per operator rather than matched, because a third of those strings are not a company name.