Data · Fab
Fab 10B / 10X and HBM advanced packaging facility
Micron, Woodlands, Singapore. Every field this record holds on the site, its note and every source, as the row states them.
Every figure links to its publisher
What changed, and when →
01
The row
- Operator
- Micron · company page: Micron Technology
- Site
- Fab 10B / 10X and HBM advanced packaging facility
- Location
- Woodlands, Singapore
- Type
- memory
- Status
- construction
- Wafer
- 300 mm
- Nodes
- 3D NAND
- First output
- not recorded
- Announced investment
- USD 24 billion
- Map position
- 1.44, 103.8, on the map
New 3D NAND fab plus a separate HBM advanced-packaging facility, part of a US$24B Singapore investment announced January 2026.
02
Sources
2 sources on this row, in the order the row lists them. The order carries no weight.
Micron to invest $24 billion in Singapore plant as AI boom strains global memory supply - CNBC · cnbc.com
Micron breaks ground on new HBM advanced packaging facility in Singapore - Singapore EDB · edb.gov.sg
03
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.