Silicon Almanac. every figure links to its publisher  
Data · Nodes

Which fabs fall in which band.

A fab holds the process nodes its operator said it runs. A publisher holds what it said the bands were, on a stated date. This page is those two put together, under each definition separately, with the date of the definition that drew it.

01

What can be placed at all

Counted from the same two files the tables below read. A site with no published node value is absent from every band here, which is a fact about what its operator publishes.

194 fab sites in this record. 95 list at least one process node. The rest publish none, and are not counted as anything.

DefinitionBandsSites placedNode values the bands do not cover
SEMI, 2025-01-073230
SEMI, 2025-06-252913

The two definitions place different numbers of sites because they define different things: the January wording covers the whole range in three bands, the June one reports only the advanced end. Neither is a subset of the other and they are not merged.

02

SEMI, 2025-01-07

As published in World Fab Forecast, SEMI press release, 7 January 2025, on a 200mm equivalent basis. The definition, with its citation.

Advanced

The publisher's own wording: “advanced nodes (7nm and below)”. 9 sites in this record run a node that falls inside it.

OperatorFabLocationCountryStatusNodes that placed it
JASM (TSMC / Sony / Denso / Toyota)Kumamoto Fab 2Kikuyo, KumamotoJPconstruction4nm, 6nm
RapidusIIM-1Chitose, HokkaidoJPconstruction2nm
Samsung ElectronicsHwaseong CampusHwaseongKRoperating4nm, 5nm, 7nm
TSMCFab 12Hsinchu Science ParkTWoperating7nm
TSMCFab 15Central Taiwan Science Park, TaichungTWoperating7nm
TSMCFab 18Southern Taiwan Science Park, TainanTWoperating3nm, 5nm
TSMCFab 20Baoshan, Hsinchu Science ParkTWoperating2nm
TSMCFab 22Kaohsiung (Qiaotou) Science ParkTWoperating2nm
TSMCFab 25 (new advanced fab)Central Taiwan Science Park, TaichungTWconstruction2nm

Mainstream

The publisher's own wording: “mainstream nodes (8nm~45nm)”. 13 sites in this record run a node that falls inside it.

OperatorFabLocationCountryStatusNodes that placed it
Hua Hong SemiconductorWuxi Fab (Hua Hong 7 / Fab 9)WuxiCNoperating40nm
IntelFab 28Kiryat GatILoperating14nm
JASM (TSMC / Sony / Denso / Toyota)Kumamoto Fab 1Kikuyo, KumamotoJPoperating12nm, 16nm, 22nm, 28nm
Nexchip SemiconductorHefei FabHefeiCNoperating28nm, 40nm
Powerchip Semiconductor Manufacturing Corp (PSMC)P1-P3 FabsChiayiTWoperating40nm
SMICBeijing Mega-fab (SMIC Beijing/SMIC12)Yizhuang, BeijingCNoperating14nm, 28nm
SMICShanghai (Zhangjiang) FabsShanghaiCNoperating14nm, 28nm
TSMCFab 12Hsinchu Science ParkTWoperating10nm, 16nm, 28nm, 40nm
TSMCFab 14Southern Taiwan Science Park, TainanTWoperating28nm, 40nm
TSMCFab 15Central Taiwan Science Park, TaichungTWoperating16nm, 20nm, 28nm, 40nm
UMCFab 12ATainan Science ParkTWoperating14nm, 22nm, 28nm, 40nm
UMCFab 12iPasir Ris Wafer Fab ParkSGoperating22nm, 28nm
UMC (United Semiconductor Xiamen / USCXM)Xiamen FabXiamen, FujianCNoperating28nm, 40nm

Mature

The publisher's own wording: “mature technology nodes (50nm and above)”. 7 sites in this record run a node that falls inside it.

OperatorFabLocationCountryStatusNodes that placed it
Hua Hong SemiconductorWuxi Fab (Hua Hong 7 / Fab 9)WuxiCNoperating55nm
Hua Hong Semiconductor (Hua Hong Grace)Shanghai Fabs 1-3ShanghaiCNoperating65nm, 90nm
Nexchip SemiconductorHefei FabHefeiCNoperating55nm
Powerchip Semiconductor Manufacturing Corp (PSMC)P1-P3 FabsChiayiTWoperating55nm
TSMCFab 14Southern Taiwan Science Park, TainanTWoperating65nm, 90nm, 130nm
Tata ElectronicsDholera FabDholera, GujaratINoperating90nm
UMCFab 8ABHsinchu Science ParkTWoperating90nm, 0.13um
03

SEMI, 2025-06-25

As published in 300mm Fab Outlook, SEMI press release, 25 June 2025, on a 300mm actual basis. The definition, with its citation.

2nm and below

The publisher's own wording: “2nm and below”. 4 sites in this record run a node that falls inside it.

OperatorFabLocationCountryStatusNodes that placed it
RapidusIIM-1Chitose, HokkaidoJPconstruction2nm
TSMCFab 20Baoshan, Hsinchu Science ParkTWoperating2nm
TSMCFab 22Kaohsiung (Qiaotou) Science ParkTWoperating2nm
TSMCFab 25 (new advanced fab)Central Taiwan Science Park, TaichungTWconstruction2nm

Advanced

The publisher's own wording: “7nm and below”. 9 sites in this record run a node that falls inside it.

OperatorFabLocationCountryStatusNodes that placed it
JASM (TSMC / Sony / Denso / Toyota)Kumamoto Fab 2Kikuyo, KumamotoJPconstruction4nm, 6nm
RapidusIIM-1Chitose, HokkaidoJPconstruction2nm
Samsung ElectronicsHwaseong CampusHwaseongKRoperating4nm, 5nm, 7nm
TSMCFab 12Hsinchu Science ParkTWoperating7nm
TSMCFab 15Central Taiwan Science Park, TaichungTWoperating7nm
TSMCFab 18Southern Taiwan Science Park, TainanTWoperating3nm, 5nm
TSMCFab 20Baoshan, Hsinchu Science ParkTWoperating2nm
TSMCFab 22Kaohsiung (Qiaotou) Science ParkTWoperating2nm
TSMCFab 25 (new advanced fab)Central Taiwan Science Park, TaichungTWconstruction2nm

Not covered by this definition's own bands: 10nm, 12nm, 14nm, 16nm, 20nm, 22nm, 28nm, 40nm, 55nm, 65nm, 90nm, 130nm, 0.13um. These are real nanometre figures that fall outside every band this publisher named on this date. They are reported as unclassified by this definition rather than moved into whichever band is nearest.

04

What cannot be placed, and why

Every node value in this record that no band can take, with the reason. This is the larger half of the industry and it is here rather than in a footnote.

Node valuesWhy no band takes them
100, 1000, 110, 130, 140, 150, 1500, 180, 22, 250, 32, 350, 3500, 40, 45, 50, 500, 55, 600, 65, 70, 800, 90A number with no unit. Nanometres is the obvious reading and this record does not band on an obvious reading; the fab row should carry the unit.
10th-gen 3D flash (332-layer), 3D NAND, 3D NAND (Xtacking, up to 232-layer), BiCS8, DDR4, DDR5, DRAM, HBM, HBM3E, HBM4, LPDDR5, NAND, NAND flash, NOR flash, V-NAND, V-NAND (up to 236-layer)A memory product or family, not a process node.
3nm GAA, A16, Intel 14A, Intel 18A, Intel 20A, Intel 3, Intel 4, N3, N4, N5A named process. The number in the name is a marketing designation and not a measured dimension, so it is NOT translated into nanometres here: SEMI's bands are stated in nanometres, and turning 'N4' or 'Intel 18A' into a figure would be this record's inference, not a publisher's statement.
200mm SiC, GaN, SOI substrates, Si, SiC, SiC materials, glass substrateA material, not a process node. SiC and GaN fabs are described by what they process.
1-alpha DRAM, 1-beta DRAM, 1-gamma DRAM, 10nm-class DRAM, 1B DRAM, 1c DRAMA DRAM or flash generation. Makers publish these instead of a nanometre figure, on purpose: '1-gamma' names a generation and no dimension.
22/28nm-class, 28nm and above, 2nm-classNames a node loosely - a class, a range, or an open end. There is no single nanometre figure to band.
EMIB, FoverosA packaging or interconnect technology.
High-NA EUVA LITHOGRAPHY TOOL, which is not a node at all and should not be in a nodes list. Recorded here so the vocabulary is honest about it; the fab row is the thing to fix.
IGBTA device type.

The largest group is this record's own gap, not the industry's. 23 of the 69 values here are bare numbers with no unit. Nanometres is the obvious reading, and this record does not band on an obvious reading, so those sites sit in no band until the fab row states the unit.

The rest are the industry's own vocabulary, and the process names are the ones most often mistaken for figures. A modern process name is a designation and not a measured dimension: N4 is not 4nm and Intel 18A is not 1.8nm. Translating one into nanometres would put this record's inference inside a publisher's definition, so it is not done, and the fab appears in no band under either scheme.

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