Taiwan Semiconductor Manufacturing Company
Manufactures chips for other companies; the largest pure-play foundry by revenue and capacity.
- Part of the chain
- Foundries
- Headquarters
- Taiwan
- Listing
- TWSE/NYSE: TSM
- SEC CIK
- 0001046179
- Links
- Company website · Investor relations
Filed figures
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Customers and suppliers, as its annual report states them
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Fabrication and packaging sites
17 site(s) recorded on the fab map: 9 operating, 5 under construction, 3 announced. Grouped by the status each site is published under, in the same order on every page. The order is not a judgement about which sites matter. Groups of more than 6 are folded so the page does not open with a wall of rows; the fold is about length and nothing else, and every site is still on the page. A site run by a joint venture appears on every partner's page.
Operating · 9 sites
| Site | Location | Wafer | Nodes | First output |
|---|---|---|---|---|
| Kumamoto Fab 1 | Kikuyo, Kumamoto, Japan | 300 mm | 28nm, 22nm, 16nm, 12nm | 2024 |
| SSMC Fab | Pasir Ris, Singapore | 200 mm | not recorded | not recorded |
| Fab 20 | Baoshan, Hsinchu Science Park, Taiwan | 300 mm | 2nm | 2025 |
| Fab 15 | Central Taiwan Science Park, Taichung, Taiwan | 300 mm | 40nm, 28nm, 20nm, 16nm, 7nm | 2012 |
| Fab 12 | Hsinchu Science Park, Taiwan | 300 mm | 40nm, 28nm, 16nm, 10nm, 7nm | 2001 |
| Fab 22 | Kaohsiung (Qiaotou) Science Park, Taiwan | 300 mm | 2nm | 2025 |
| Fab 14 | Southern Taiwan Science Park, Tainan, Taiwan | 300 mm | 130nm, 90nm, 65nm, 40nm, 28nm | 2003 |
| Fab 18 | Southern Taiwan Science Park, Tainan, Taiwan | 300 mm | 5nm, 3nm | 2020 |
| Fab 21 Phase 1 | North Phoenix, Arizona, United States | 300 mm | N4, N5 | 2024 |
Under construction 5
| Site | Location | Wafer | Nodes | First output |
|---|---|---|---|---|
| ESMC fab | Dresden, Saxony, Germany | 300 mm | 22/28nm-class | 2027 |
| Kumamoto Fab 2 | Kikuyo, Kumamoto, Japan | 300 mm | 6nm, 4nm | not recorded |
| Fab 25 (new advanced fab) | Central Taiwan Science Park, Taichung, Taiwan | 300 mm | 2nm, A16 | not recorded |
| AP7 advanced packaging fab | Chiayi Science Park, Taiwan | not recorded | not recorded | not recorded |
| Fab 21 Phase 2 | North Phoenix, Arizona, United States | 300 mm | N3 | 2027 |
Announced 3
| Site | Location | Wafer | Nodes | First output |
|---|---|---|---|---|
| Next-generation image sensor JV fab | Kumamoto, Japan | not recorded | not recorded | not recorded |
| AP8 advanced packaging fab | Chiayi Science Park (Phase II), Taiwan | not recorded | not recorded | not recorded |
| Fabs 3-4 and advanced packaging (planned) | North Phoenix, Arizona, United States | 300 mm | 2nm-class, A16 | not recorded |
Node bands
Nodes are recorded on 13 of the 17 sites here, so this is not a full picture of what the company runs. Which bands those nodes fall into, under each definition this record holds. A band is a publisher's statement on a date and not this record's classification: N7 was the leading edge when it arrived and is ordinary now, and nothing about the node changed. So the answer is computed against each definition and shown with the date of it.
Outside every band in this scheme: 10nm, 12nm, 16nm, 20nm, 22nm, 28nm, 40nm, 65nm, 90nm, 130nm. This scheme defines only the bands above, so these are unclassified BY IT rather than placed in the nearest one.
6 value(s) on these sites are not a nanometre figure, so no scheme above places them: 22/28nm-class, 2nm-class, A16, N3, N4, N5. These bands are stated in nanometres. A named process is a designation and not a dimension - N4 is not 4nm and Intel 18A is not 1.8nm - so translating one would put this record's inference inside a publisher's definition.
Stated capacity
3 statements cover 3 of the 17 sites recorded here. They are quoted as published, because they are not the same kind of figure as each other: some are installed and some planned, some are bounds rather than figures, and some describe a whole site rather than one fab. They are not added together, here or anywhere else on this site. A total built from the sites that happen to carry a figure would be a number no publisher stated. ESMC fab is held jointly by TSMC, Bosch, Infineon, NXP; Kumamoto Fab 1 and Kumamoto Fab 2 are held jointly by TSMC, Sony Semiconductor. A joint venture's figure is the WHOLE fab's, not this company's share of it: the publisher stated the fab and said nothing about how it divides.
Published by TSMC
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Named in a headline
A literal text match on the company's name, counted and not curated. It misses items that discuss the company without naming it, and collects items that only mention the name. It is not a measure of coverage.
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How these lists are built
Matched on the company's name in the headline, counted and not curated. This is a literal text match: the name as written, or the same name in capitals, and nothing else. It is not a judgement about what an item is about, so it misses items that discuss the company without naming it, and collects items that only mention the name. It is not a measure of coverage. Strings matched: TSMC, Taiwan Semiconductor.
Sites are joined by the operator string in the fab data, which is declared per operator rather than matched, because a third of those strings are not a company name.