Data · Fab
Fabs 3-4 and advanced packaging (planned)
TSMC, North Phoenix, Arizona, United States. Every field this record holds on the site, its note and every source, as the row states them.
Every figure links to its publisher
What changed, and when →
01
The row
- Operator
- TSMC · company page: Taiwan Semiconductor Manufacturing Company
- Site
- Fabs 3-4 and advanced packaging (planned)
- Location
- North Phoenix, Arizona, United States
- Type
- packaging
- Status
- announced
- Wafer
- 300 mm
- Nodes
- 2nm-class, A16
- First output
- not recorded
- Announced investment
- not recorded
- Map position
- 33.68, -112.14, on the map
Additional fabs and an advanced-packaging facility included in TSMC's expanded roughly $165bn Arizona commitment to address AI packaging bottlenecks.
02
Sources
1 source on this row, in the order the row lists them. The order carries no weight.
TSMC Lifts Arizona to $265 Billion After Record Quarter - techtimes · techtimes.com
03
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.