Fabs 3-4 and advanced packaging (planned)
TSMC, North Phoenix, Arizona, United States. Every field this record holds on the site, its note and every source, as the row states them.
The row
- Operator
- TSMC · company page: Taiwan Semiconductor Manufacturing Company
- Site
- Fabs 3-4 and advanced packaging (planned)
- Location
- North Phoenix, Arizona, United States
- Type
- packaging
- Status
- announced
- Wafer
- 300 mm
- Nodes
- 2nm-class, A16
- First output
- not recorded
- Announced investment
- not recorded
- Map position
- 33.68, -112.14, on the map
Further fabs and advanced packaging capacity in Arizona. Tech Times reported on 17 July 2026 that TSMC raised its total US commitment from $165bn to $265bn across 12 facilities, including CoWoS packaging capacity.
Sources
1 source on this row, in the order the row lists them. The order carries no weight.
TSMC Lifts Arizona to $265 Billion After Record Quarter - techtimes · techtimes.com
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.
On this record
What this record changed on this row, newest first. Each day is the day this record changed, never the day a publisher said it. Followed: status, first output year, announced investment, operator, name, site and sources.
2026-08-13 · The row entered this record, with the status announced. · Source at entry: TSMC Lifts Arizona to $265 Billion After Record Quarter - techtimes
None of the fields followed here has changed since the row entered this record on 2026-08-13.