ESMC capacity at Dresden, Saxony
TSMC on the planned Dresden fab, as described when the joint venture was established, stated 2023-08-08. One statement, with the wording it was made in. Nothing here is computed and nothing is added to anything else.
What was stated
Issued 2023-08-08 by TSMC · TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023
A planned figure: capacity the publisher said the site is expected to reach. A promise and a measurement are different facts and this record never puts them in one column.
Wafer basis: 300mm actual. Two figures on different bases are 2.25 times apart before anything real has changed, which is why no figure here is shown without one.
"Expected" is a hedge about certainty and timing, not about the number, so it takes no `bound`: the publisher stated 40,000 and stated that it is a plan. `kind: planned` is what carries the hedge. The release also gives ownership as TSMC 70% with Bosch, Infineon and NXP each at 10%; ownership is not capacity and no share of the figure is attributed to any partner.
What this figure covers
Publishers state capacity at whatever level suits them: a phase, a site, a joint venture, a company. This one covers the sites below and no others.
The planned Dresden fab, as described when the joint venture was established
| Fab | Site | Country | Status |
|---|---|---|---|
| ESMC fab | Dresden, Saxony | DE | construction |
This figure is never added to another. This record holds a capacity statement for 1 of the 1 ESMC (TSMC / Bosch / Infineon / NXP joint venture) site it lists, so a sum of what is here would be a company total built from an incomplete set and published by nobody.
Everything stated about this site
2 statements, oldest first. A later figure never overwrites an earlier one here, so what was said before is still readable, with its date.
| Issued | As published | Kind | Source | |
|---|---|---|---|---|
| 2023-08-08 | The planned fab is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology | planned | this statement | TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023 |
| 2024-08-20 | When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology | planned | open | ESMC Breaks Ground on Dresden Fab, 20 August 2024 |
Cite this
The figure in the publisher's own words, what it covers, the basis it is counted on, and the source. A capacity figure quoted without its basis or its coverage is the failure this block exists to prevent.
For a memo
TSMC, planned capacity, the planned Dresden fab, as described when the joint venture was established: The planned fab is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, issued 2023-08-08, on a 300mm actual wafer basis. Source: TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023, https://pr.tsmc.com/english/news/3049. Recorded by Silicon Almanac, which keeps every statement made about this site: https://siliconalmanac.com/figure/fab-capacity/esmc-dresden-2023-08/
Everything in one paragraph. There is no earlier statement about this site to carry.
For the bottom of a slide
Source: TSMC (2023-08-08), TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023. Wafer basis: 300mm actual. Statement history: https://siliconalmanac.com/figure/fab-capacity/esmc-dresden-2023-08/
One line. The value is deliberately not repeated here: on a slide the number is on the slide, and a footnote that restates it is one edit away from disagreeing with it.
For a spreadsheet
publisher covers kind value_as_published wafer_basis issued qualifiers source_title source_url previous_value previous_issued figure_page retrieved TSMC The planned Dresden fab, as described when the joint venture was established planned The planned fab is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology 300mm actual 2023-08-08 TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023 https://pr.tsmc.com/english/news/3049 https://siliconalmanac.com/figure/fab-capacity/esmc-dresden-2023-08/
Two lines, tab separated: the headings and one row. The wafer basis and the qualifiers are columns rather than notes, so a row pasted into a model carries them where the model can see them.
Keep this citation on your desk → The desk keeps the value you took and the date you took it, and tells you if the publisher restates it.
Elsewhere in this record
No values here, only where to find them. Two capacity figures side by side is a comparison, and these are not comparable unless they share a wafer basis.
Other sites with a stated capacity: The Kumamoto site as a whole, both fabs together · The Agrate Brianza 300mm fab · The Agrate Brianza 300mm fab, beyond the 2027 target · The Crolles 300mm fab · The Crolles 300mm fab, beyond the 2027 target · The Sherman, Texas site as the award describes it, across the fabs it funds · The Bloomington, Minnesota fab · The Bloomington, Minnesota fab