ESMC capacity at Dresden, Saxony
TSMC on the planned Dresden fab, as described when the joint venture was established, stated 2023-08-08. One statement, with the wording it was made in. Nothing here is computed and nothing is added to anything else.
What was stated
Issued 2023-08-08 by TSMC · TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023
A planned figure: capacity the publisher said the site is expected to reach. A promise and a measurement are different facts and this record never puts them in one column.
Wafer basis: 300mm actual. Two figures on different bases are 2.25 times apart before anything real has changed, which is why no figure here is shown without one.
"Expected" is a hedge about certainty and timing, not about the number, so it takes no `bound`: the publisher stated 40,000 and stated that it is a plan. `kind: planned` is what carries the hedge. The release also gives ownership as TSMC 70% with Bosch, Infineon and NXP each at 10%; ownership is not capacity and no share of the figure is attributed to any partner.
What this figure covers
Publishers state capacity at whatever level suits them: a phase, a site, a joint venture, a company. This one covers the sites below and no others.
The planned Dresden fab, as described when the joint venture was established
| Fab | Site | Country | Status |
|---|---|---|---|
| ESMC fab | Dresden, Saxony | DE | construction |
This figure is never added to another. This record holds a capacity statement for 1 of the 1 ESMC (TSMC / Bosch / Infineon / NXP joint venture) site it lists, so a sum of what is here would be a company total built from an incomplete set and published by nobody.
Everything stated about this site
2 statements, oldest first. A later figure never overwrites an earlier one here, so what was said before is still readable, with its date.
| Issued | As published | Kind | Source | |
|---|---|---|---|---|
| 2023-08-08 | The planned fab is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology | planned | this statement | TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023 |
| 2024-08-20 | When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology | planned | open | ESMC Breaks Ground on Dresden Fab, 20 August 2024 |
Cite this
The figure in the publisher's own words, what it covers, the basis it is counted on, and the source. A capacity figure quoted without its basis or its coverage is the failure this block exists to prevent.
For a memo
TSMC, planned capacity, the planned Dresden fab, as described when the joint venture was established: The planned fab is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, issued 2023-08-08, on a 300mm actual wafer basis. Source: TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023, https://pr.tsmc.com/english/news/3049. Recorded by Silicon Almanac, which keeps every statement made about this site: https://siliconalmanac.com/figure/fab-capacity/esmc-dresden-2023-08/
Everything in one paragraph. There is no earlier statement about this site to carry.
For the bottom of a slide
Source: TSMC (2023-08-08), TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023. Wafer basis: 300mm actual. Statement history: https://siliconalmanac.com/figure/fab-capacity/esmc-dresden-2023-08/
One line. The value is deliberately not repeated here: on a slide the number is on the slide, and a footnote that restates it is one edit away from disagreeing with it.
For a spreadsheet
publisher covers kind value_as_published wafer_basis issued qualifiers source_title source_url previous_value previous_issued figure_page retrieved TSMC The planned Dresden fab, as described when the joint venture was established planned The planned fab is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology 300mm actual 2023-08-08 TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe, 8 August 2023 https://pr.tsmc.com/english/news/3049 https://siliconalmanac.com/figure/fab-capacity/esmc-dresden-2023-08/
Two lines, tab separated: the headings and one row. The wafer basis and the qualifiers are columns rather than notes, so a row pasted into a model carries them where the model can see them.
Elsewhere in this record
No values here, only where to find them. Two capacity figures side by side is a comparison, and these are not comparable unless they share a wafer basis.
Other sites with a stated capacity: The Kumamoto site as a whole, both fabs together · The Agrate Brianza 300mm fab · The Agrate Brianza 300mm fab, beyond the 2027 target · The Crolles 300mm fab · The Crolles 300mm fab, beyond the 2027 target · The Sherman, Texas site as the award describes it, across the fabs it funds · The Bloomington, Minnesota fab · The Bloomington, Minnesota fab