Onyang HBM packaging plant
Samsung Electronics, Onyang, Asan, South Chungcheong, South Korea. Every field this record holds on the site, its note and every source, as the row states them.
The row
- Operator
- Samsung Electronics · company page: Samsung Electronics
- Site
- Onyang HBM packaging plant
- Location
- Onyang, Asan, South Chungcheong, South Korea
- Type
- packaging
- Status
- announced
- Wafer
- not recorded
- Nodes
- not recorded
- First output
- not recorded
- Announced investment
- USD 4.31 billion
- Map position
- 36.78, 127.0, on the map
HBM advanced packaging on Samsung's existing Onyang campus. Reported at KRW 6 trillion, which the same report converts to about USD 4.31 billion; the dollar figure is the publisher's conversion, not this record's. Groundbreaking reported for September 2026 after a provincial urban-planning review was cleared, and no production start date has been published. Status is 'announced' rather than 'construction' because the groundbreaking had not taken place when this row was added on 1 September 2026.
Sources
1 source on this row, in the order the row lists them. The order carries no weight.
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September - DIGITIMES · digitimes.com
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.
On this record
What this record changed on this row, newest first. Each day is the day this record changed, never the day a publisher said it. Followed: status, first output year, announced investment, operator, name, site and sources.
2026-09-01 · The row entered this record, with the status announced. · Source at entry: Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September - DIGITIMES
None of the fields followed here has changed since the row entered this record on 2026-09-01.