Disco Corporation
Makes wafer dicing and grinding equipment used in chip packaging.
- Part of the chain
- Wafer fab equipment and test
- Headquarters
- Japan
- Listing
- TSE: 6146
- SEC CIK
- not recorded
- Links
- Company website · Investor relations
Filed figures
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Fabrication and packaging sites
No site on the fab map is recorded under this company. That means the record holds none, not that none exists: the fab map covers sites this record could verify from public sources.
Published by Disco
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Named in a headline
A literal text match on the company's name, counted and not curated. It misses items that discuss the company without naming it, and collects items that only mention the name. It is not a measure of coverage.
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How these lists are built
Matched on the company's name in the headline, counted and not curated. This is a literal, case-sensitive text match and not a judgement about what an item is about: it misses items that discuss the company without naming it, and collects items that only mention the name. It is not a measure of coverage. Strings matched: DISCO Corporation, Disco Corporation.
No fab site is attributed to this company in the record.