Data · Fab
Central Taiwan Science Park Fab
Winbond, Taichung, Taiwan. Every field this record holds on the site, its note and every source, as the row states them.
Every figure links to its publisher
What changed, and when →
01
The row
- Operator
- Winbond · company page: Winbond Electronics
- Site
- Central Taiwan Science Park Fab
- Location
- Taichung, Taiwan
- Type
- memory
- Status
- operating
- Wafer
- 300 mm
- Nodes
- NOR flash, DDR4
- First output
- not recorded
- Announced investment
- not recorded
- Map position
- 24.21, 120.61, on the map
02
Sources
1 source on this row, in the order the row lists them. The order carries no weight.
Winbond prepares 16nm 8Gb DDR4 mass production for 2026 - DigiTimes · digitimes.com
03
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.