Central Taiwan Science Park Fab
Winbond, Taichung, Taiwan. Every field this record holds on the site, its note and every source, as the row states them.
The row
- Operator
- Winbond · company page: Winbond Electronics
- Site
- Central Taiwan Science Park Fab
- Location
- Taichung, Taiwan
- Type
- memory
- Status
- operating
- Wafer
- 300 mm
- Nodes
- NOR flash, DDR4
- First output
- not recorded
- Announced investment
- not recorded
- Map position
- 24.21, 120.61, on the map
Sources
1 source on this row, in the order the row lists them. The order carries no weight.
Winbond prepares 16nm 8Gb DDR4 mass production for 2026 - DigiTimes · digitimes.com
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.
On this record
What this record changed on this row, newest first. Each day is the day this record changed, never the day a publisher said it. Followed: status, first output year, announced investment, operator, name, site and sources.
2026-08-13 · The row entered this record, with the status operating. · Source at entry: Winbond prepares 16nm 8Gb DDR4 mass production for 2026 - DigiTimes
None of the fields followed here has changed since the row entered this record on 2026-08-13.