West Lafayette advanced packaging plant
SK Hynix, West Lafayette, Indiana, United States. Every field this record holds on the site, its note and every source, as the row states them.
The row
- Operator
- SK Hynix · company page: SK Hynix
- Site
- West Lafayette advanced packaging plant
- Location
- West Lafayette, Indiana, United States
- Type
- packaging
- Status
- construction
- Wafer
- not recorded
- Nodes
- not recorded
- First output
- 2029
- Announced investment
- USD 4 billion
- Map position
- 40.47, -86.94, on the map
Advanced packaging and test for HBM. SK hynix states that wafers made in Korea are shipped here for packaging and testing, so no wafers are fabricated on this site. Groundbreaking 27 August 2026 local time, cleanroom targeted for October 2028, mass production of next-generation HBM in the second half of 2029. INVESTMENT IS REPORTED TWO WAYS and this record carries the later figure: "over $4 billion" at the groundbreaking, against $3.87 billion in reporting from earlier in August 2026. An Advanced Packaging R&D Testbed is announced alongside the production lines. This is NOT the SkyWater West Lafayette project, which is a separate paused site in the same town, recorded here as skywater-indiana-westlafayette.
Sources
3 sources on this row, in the order the row lists them. The order carries no weight.
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana - Semiconductor Digest · semiconductor-digest.com
SK hynix breaks ground on $4 billion packaging facility in Indiana - Evertiq · evertiq.com
SK hynix breaks ground on the first HBM plant in the US - Tom's Hardware · tomshardware.com
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.