Data · Fab
Kulim advanced packaging complex (Malaysia 11 / 'Project Pelican')
Intel, Kulim, Kedah, Malaysia. Every field this record holds on the site, its note and every source, as the row states them.
Every figure links to its publisher
What changed, and when →
01
The row
- Operator
- Intel · company page: Intel
- Site
- Kulim advanced packaging complex (Malaysia 11 / 'Project Pelican')
- Location
- Kulim, Kedah, Malaysia
- Type
- packaging
- Status
- operating
- Wafer
- not recorded
- Nodes
- EMIB, Foveros
- First output
- 2026
- Announced investment
- USD 7 billion
- Map position
- 5.37, 100.56, on the map
US$7B advanced packaging complex; first-phase operations reported underway in 2026.
02
Sources
2 sources on this row, in the order the row lists them. The order carries no weight.
Intel Ramps Up Advanced Packaging: Malaysia Complex Operational in 2026 - TrendForce · trendforce.com
Intel Completes 'Project Pelican' Malaysia Packaging Fab for EMIB and Foveros - TechPowerUp · techpowerup.com
03
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.