Kulim advanced packaging complex (Malaysia 11 / 'Project Pelican')
Intel, Kulim, Kedah, Malaysia. Every field this record holds on the site, its note and every source, as the row states them.
The row
- Operator
- Intel · company page: Intel
- Site
- Kulim advanced packaging complex (Malaysia 11 / 'Project Pelican')
- Location
- Kulim, Kedah, Malaysia
- Type
- packaging
- Status
- operating
- Wafer
- not recorded
- Nodes
- EMIB, Foveros
- First output
- 2026
- Announced investment
- USD 7 billion
- Map position
- 5.37, 100.56, on the map
US$7B advanced packaging complex. TrendForce and TechPowerUp reported the first phase operational in 2026.
Sources
2 sources on this row, in the order the row lists them. The order carries no weight.
Intel Ramps Up Advanced Packaging: Malaysia Complex Operational in 2026 - TrendForce · trendforce.com
Intel Completes 'Project Pelican' Malaysia Packaging Fab for EMIB and Foveros - TechPowerUp · techpowerup.com
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.
On this record
What this record changed on this row, newest first. Each day is the day this record changed, never the day a publisher said it. Followed: status, first output year, announced investment, operator, name, site and sources.
2026-08-13 · The row entered this record, with the status operating. · Source at entry: Intel Ramps Up Advanced Packaging: Malaysia Complex Operational in 2026 - TrendForce · Source at entry: Intel Completes 'Project Pelican' Malaysia Packaging Fab for EMIB and Foveros - TechPowerUp
None of the fields followed here has changed since the row entered this record on 2026-08-13.