Assembly, test and packaging facility
Broadcom, Spain (specific site not publicly finalized), Spain. Every field this record holds on the site, its note and every source, as the row states them.
The row
- Operator
- Broadcom · company page: Broadcom
- Site
- Assembly, test and packaging facility
- Location
- Spain (specific site not publicly finalized), Spain
- Type
- packaging
- Status
- cancelled
- Wafer
- not recorded
- Nodes
- not recorded
- First output
- not recorded
- Announced investment
- USD 1 billion
- Map position
- not recorded
Broadcom announced a roughly $1bn assembly, test and packaging facility in Spain in 2023, under the EU and Spanish Chips Act programmes. EE Times reported in July 2025, citing Europa Press, that Broadcom cancelled the project after negotiations with the Spanish government broke down. Status corrected 1 October 2026 from paused to cancelled.
Sources
2 sources on this row, in the order the row lists them. The order carries no weight.
Broadcom Cancels Spain Fab, Impacting Semiconductor Ambitions - EE Times · eetimes.com
Broadcom announces $1bn semiconductor investment in Spain - Investment Monitor · investmentmonitor.ai
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.
On this record
What this record changed on this row, newest first. Each day is the day this record changed, never the day a publisher said it. Followed: status, first output year, announced investment, operator, name, site and sources.
2026-10-01 · This record changed the name from Assembly, test and packaging facility (planned) to Assembly, test and packaging facility. This record changed the status from paused to cancelled.
2026-08-13 · The row entered this record, with the status paused. · Source at entry: Broadcom Cancels Spain Fab, Impacting Semiconductor Ambitions - EE Times · Source at entry: Broadcom announces $1bn semiconductor investment in Spain - Investment Monitor