Data · Fab
Assembly, test and packaging facility (planned)
Broadcom, Spain (specific site not publicly finalized), Spain. Every field this record holds on the site, its note and every source, as the row states them.
Every figure links to its publisher
What changed, and when →
01
The row
- Operator
- Broadcom · company page: Broadcom
- Site
- Assembly, test and packaging facility (planned)
- Location
- Spain (specific site not publicly finalized), Spain
- Type
- packaging
- Status
- paused
- Wafer
- not recorded
- Nodes
- not recorded
- First output
- not recorded
- Announced investment
- USD 1 billion
- Map position
- not recorded
Broadcom announced a roughly $1bn ATP facility in Spain in 2023 under the EU/Spanish Chips Act support programs; Broadcom cancelled the project in July 2025 after negotiations with the Spanish government broke down.
02
Sources
2 sources on this row, in the order the row lists them. The order carries no weight.
Broadcom Cancels Spain Fab, Impacting Semiconductor Ambitions - EE Times · eetimes.com
Broadcom announces $1bn semiconductor investment in Spain - Investment Monitor · investmentmonitor.ai
03
Capacity statements
No published capacity statement names this site. Blank is unpublished, not zero.